| 摘要 |
<p>PURPOSE:To restrain the fluctuation in the power supply voltage while making the cost reduction of printed-wiring board and the area contraction feasible by reducing the numbers of condensers by making use of an electrostatic capacitor between a semiconductor substrate and a lead frame to stabilize the power supply voltage. CONSTITUTION:A semiconductor substrate 1 is connected to one power supply potential while a lead frame 12 to be bonded to the substrate 1 is connected to the other power supply potential so as to form an electrostatic capacitor 19 between the two power supply potentials to stabilize the power supply voltage. That is, the electrostatic capacitor 19 formed of a wax material as an insulator using the semiconductor substrate 1 and the lead frame 12 as both electrodes can stabilize the power supply voltage by absorbing the transient power supply current generated by a semiconductor integrated circuit. Through these procedures, the power supply voltage more stabilized can be secured while reducing the numbers of condensers advancing the cost of the printed- wiring board.</p> |
