| 摘要 |
<p>PURPOSE:To obtain a substrate assembly of high density, by constituting a configuration wherein each IC chip is mounted on both surfaces of a substrate, wires are bonded, and all parts are sealed with resin. CONSTITUTION:A substrate assembly 20 has the following structure. IC chips 4, 5 and a capacitor 6 are surface-mounted on one surface 3 of a substrate 2, wires 7, 8 are subjected to ultrasonic wave bonding to the IC chips 4, 5, and these parts are sealed with synthetic resin 9, 10. An IC chip 21 and a capacitor 22 are surface-mounted on the other surface 13 of the substrate 2, wires 23 are subjected to ultrasonic wave bonding to the IC chip 21, and these parts are sealed with synthetic resin 24. By using the substrate assembly 20, both surfaces 3, 13 of the substrate 2 are used as the mounting surface of IC chips requiring wire bonding, so that the level of integration is almost doubled as compared with conventional cases, and the size is reduced.</p> |
