发明名称 THICK FILM MULTILAYER CIRCUIT BOARD
摘要 PURPOSE:To avoid the occurrence of fault conduction between conductors by making the diffusion speed in mutual diffusion between the third conductor layer and the first conductor layer during baking equal to or slower than the diffusion speed in mutual diffusion between the second conductor layer and the first conductor layer. CONSTITUTION:When the diffusion speed of a conductive material forming the first conductor layer 34 is larger than the diffusion speed of a conductive material forming the second conductor layer 40, the third conductor layer 32 is formed by using a conductive material having the diffusion speed equal to or slower than the diffusion speed of the conductive material forming the second conductor layer 40 below the first conductor layer 34. Because of this, the occurrence of cavities in the first conductor layer 34 is blocked in the mutual diffusion process being performed between the second conductor layer 40 and the first conductor layer 34 due to the effect of mutual diffusion between the third conductor layer 32 and the first conductor layer 34 performed during baking. By doing this, the first conductor layer 34 can be electrically connected to the second conductor layer 40 without causing defective conduction in the laminated portion of the conductive material.
申请公布号 JPH04196499(A) 申请公布日期 1992.07.16
申请号 JP19900327172 申请日期 1990.11.28
申请人 NGK INSULATORS LTD 发明人 YAMADA TOMOHIRO
分类号 H05K1/09;H01L23/12;H01L23/13;H05K3/46 主分类号 H05K1/09
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