| 摘要 |
PURPOSE:To enhance the connecting strength of a semiconductor element to a lead by a method wherein a hole is made in a lead frame and an electrode for the semiconductor element is connected directly to the lead frame by using a gold ball. CONSTITUTION:A hole 2 made in a lead frame 1 is aligned with an electrode 4 for a semiconductor element 5. After that, a gold ball 3 is driven into the hole 2 and pressed. Then, a gold wire 6 is cut, and the electrode 4 for the semiconductor element 5 is connected to the lead frame 1. As a result, the gold ball 3, the lead frame 1 and the electrode can be connected by one pressure welding operation, and no distance exits between the electrode 4 and the lead frame 1. As a result, a strength can be designed freely. Thereby, it is possible to enhance the connecting strength of the semiconductor element to a lead. |
