| 摘要 |
PURPOSE:To enhance a semiconductor element in operational speed so as to enable a computer system to operate at a higher speed by a method wherein the evaporator of a refrigerator and a specific semiconductor element out of semiconductor elements which increases in operational speed when it is cooled down are thermally coupled through a cooling member. CONSTITUTION:A cooling source is generated by a refrigerator 15 and brought into thermal contact with an evaporator 31, and a cooling member 4 which is flexible and high in thermal conductivity is arranged between the evaporator 31 and a semiconductor element 1 to enable them to be thermally coupled together. For instance, a specific element such as a CMOS or the like is enhanced in operational speed when it is cooled down. The cooling member 4, which connects the semiconductor element 1 to the evaporator that serves as a cooling source, is able to make its surface come into close contact with the surface of elements various in height to fill a gap between them small in contact thermal resistance, whereby heat can be dissipated enough from the semiconductor element 1 to lessen the element 1 in operating temperature. By this setup, a specific element which limits the operational speed of a system as a whole is lessened in operating temperature and enhanced in operational speed by dissipating heat with a cooling structure high in heat dissipation value, whereby an electronic computer can be enhanced in operation speed. |
