| 摘要 |
PURPOSE:To perform a wire bonding between orthogonal two surfaces by providing a work rotating mechanism for positioning the two surfaces in a plane, and recognition means for indexing the bonding position of the two surfaces of the work in the plane. CONSTITUTION:When a bonding pad in a heat generating board 2 is recognized and indexed, a stage 16 is rotated reversely at 90 degrees, and advanced to a bonding operation. In the operation, the bonding pad of a driving IC 4 is initially bonded, a tool 12 is then raised at a high speed, the stage 16 is rotated at 90 degrees, and the board 2 is positioned on a horizontal surface. The bonding pad of the board 2 is secondly bonded, and thus corresponding two points of the pads of the IC 4 and the board 2 are wire bonded. The tool 12 is raised at a high speed, the stage 16 is rotated reversely at 90 degrees, similar operation is repeated, and orthogonal two surfaces are sequentially wire bonded. |
