| 摘要 |
<p>PURPOSE:To prevent a change in the pressure inside a metal package due to the thermal expansion of a shock-relaxing agent, to eliminate a stress onto a semiconductor element and to eliminate the deformation of the metal package by a method wherein a vacuum chamber is installed in one part inside the metal package. CONSTITUTION:At a semiconductor acceleration detection device, a vacuum chamber 7 is installed in one part inside a metal package 1. Thereby, a change in the internal pressure of the metal package 1 due to the thermal expansion of a shock-relaxing agent 6 can be absorbed by the vacuum chamber 7. For example, a silicone oil whose coefficient of thermal expansion is at 0.94X10<-3>/ deg.C is used as a shock-relaxing agent 6. When a vacuum chamber 7 whose internal volume is at 10 % of that of a metal package 1 is installed inside the package, it is possible to restrain a change in the internal pressure of the metal package 1 up to 125 deg.C. Thereby, it is possible to prevent the change in the internal pressure due to the thermal expansion of the shock-relaxing agent, to eliminate a stress onto a semiconductor element and to prevent the deformation of the metal package.</p> |
