| 摘要 |
PURPOSE:To obtain a bake oven of a photoresist coater in which the ununiformity of resist film thickness in a baking process is prevented, by installing a means for rotating a semiconductor substrate on a hot plate. CONSTITUTION:Proximity pins 5 rotate in the arrow direction at a constant speed, along a rotation groove 10 between a hot plate 1 and a circular hot plate 9. In a baking process, a semiconductor substrate 8 is mounted on the proximity pins 5, from a carriage aperture 7 by beams 6 for conveying, and then the semiconductor substrate 8 is rotated at a constant speed. The rotation time is equal to the baking process time. As to problems of gas purge, temperature distribution ununiformity in the hot plate surface, temperature decrease of the carriage aperture, etc., the semiconductor substrate 8 under processing is rotated, thereby averaging these influences and preventing the ununiformity of resist film thickness. |
