TAB TAPE, METHOD OF BONDING TAB TAPE AND TAB PACKAGE

摘要

PURPOSE: To easily and surely prevent the elevation of a chip due to the sticking of a bonding tool and lead at the time of bonding by providing a chip holding means extended into the opening of an insulation tape. CONSTITUTION: The bonding tool 28 is lowered, the four inclined surfaces 36 of the bonding tool are engaged with the projected part 32 of a chip holding member 30 and the projected part 32 is bent downwards. The bonding tool is moved while bending the projected part 32 by the inclined surfaces 36 and thermo-compression bonds an inner lead part 18 to a pad 26 by a bottom surface 34. When the bonding tool 28 is elevated, even when the lead part 18 is stuck to the bottom surface 34, the projected part 32 of the chip holding member 30 is engaged with the pad side back surface of the chip and movement is obstructed.