| 摘要 |
PURPOSE:To improve integration without expanding the flat plane constitution of a semiconductor device by providing a means which connects chip planes by overlapping them so as to permit the chip planes to face each other for the semiconductor device whose circuits are provided on the chips. CONSTITUTION:Two chips A and B are overlapped so as to permit the chip flat planes to face each other, and circuits 10 and 12 are provided on the facing planes. The device is provided with a connecting parts 14A and 14B which connect the circuits 10 and 12, a grounded conductive sheet 16 for shielding the mutual intervention and pins 18 for the transmission of signals between A, B and the external part. The connecting parts 14A and 14B are formed to direct downward and upward, respectively, and conductive pads are provided and bumps 20A and 20B are formed at the bottom and top. For the conductive sheet 16 for shielding, windows 22 are provided at the positions corresponding to the bumps 20A and 20B, the bumps 20A and 20B pass through the windows to adhere and are connected so as not to make contact with the sheet 16. Thus, the circuit constituted of the two chips is constituted without expanding the flat area. |
