| 摘要 |
PURPOSE:To enhance the efficiency of mounting each electronic component by preparing assemble data from common data associated with an electronic component assembling device and error data during trial testing and correcting the data per device. CONSTITUTION:Electronic components are installed and fixed on a board based on component assemble data which indicates the mounting position of electronic components on the board, using an assemble data preparation machine 1. A positional error detection circuit 24 detects the relative positions of the components with the board and calculates error between the detected value and the assemble data for each of chip mounters 3 to n. This data is supplied to the machine 1 which prepares component assemble data as common data associated with the mounters 3 to n when the mount position information of the components is provided. Then, the machine 1 outputs this data to the mounters 3 to n and prepares assemble data per mounter in actual operation based on the common data and the error data per mounter. It is, therefore, possible to enhance the efficiency of component packaging. |
