| 摘要 |
<p>PURPOSE:To contrive a space-saving and an improvement in precision of a location recognition by a method wherein wafers are recognized by moving a photoelectric type sensor in which the wafers are secured to a semiconductor manufacturing equipment. CONSTITUTION:A processing jig 1 receiving a semiconductor wafer 2 is secured to a semiconductor manufacturing equipment. A photoelectric type sensor 6 is fitted into a stage 7 and moves in the moving directions 13, 14. A driving shaft 9 is rotated by a driving motor 10 to move the stage 7. A reference plate 3 is fitted into a blacket 5 through a spacer 4 and secured to the semiconductor manufacturing equipment. Thus, the photoelectric type sensor 6 is moved, whereby the wafer 2 can be recognized to contrive to space-save the semiconductor manufacturing equipment. Moreover, after the reference plate 3 is recognized by the sensor 6, the wafer 2 is successively recognized and it is possible to read a location of the wafer from the plate 3 as a moving distance of the sensor 6.</p> |
