发明名称 PROCESS FOR MANUFACTURING HOUSINGS FOR HYBRID INTEGRATED CIRCUITS
摘要 <p>A process for manufacturing housings for hybrid integrated circuits consists in shaping a sheet metal cut-out to form the actual housing (10A), sealing in (17) feed-through pins (16) and then closing with a lid. The dimensions of the actual housing (10A), which can be manufactured without special tools, are optional. The corners of the sheet metal cut-out are notched or cut away, and the side parts (11A, -14A) so obtained are bent upward leaving a narrow gap (15) in each case, which is then closed by hard soldering; the lid is made by joining two sheet metal cut-outs, one of which is inserted in the housing (10A) and the other of which covers the latter. Even relatively deep housings (10A) can be manufactured. Cooling and fastening tabs integral with the housing are obtained by cutting away the corners of the side parts (11A, 12A).</p>
申请公布号 EP0441785(B1) 申请公布日期 1992.07.15
申请号 EP19890908164 申请日期 1989.07.20
申请人 TECHNOTRON ELEKTROTECHNISCHE GERAETE UND KOMPONENTEN GMBH & CO. KG 发明人 MEISLITZER, KARL-HEINZ
分类号 H01L21/48 主分类号 H01L21/48
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