| 摘要 |
Disclosed is a spring clip fastener for mounting a heat sink and a semiconductor device package to the surface of a circuit board. The fastener includes a spring portion and support members extending from the spring portion for supporting the spring portion above the surface of the circuit board. A shoulder is internally formed in the support members so that the spring portion urges the semiconductor device package against the heat sink. Feet extend from the support members for engaging the surface of the circuit board. The feet are coated with a solder-promoting material.
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