| 摘要 |
PURPOSE:To enhance the accuracy of property test by installing a property test contact pad between a semiconductor device of a lead wire and a burn-in test contact pad. CONSTITUTION:A property test contact pad 22 is installed between a semiconductor device of a lead wire 21 and a burn-in test contact pad 22. In this manner, the property test contact pad 23 is installed between the semiconductor device and the burn-in test contact pad 22, which forces the property test contact pad 23 to approach the semiconductor device, which results in the reduction in the length of the lead wire. As a result, the inductance is lowered. This construction makes it possible to measure the property test contact pad 23 with higher accuracy than the burn-in test contact pad, thereby enhancing measurement accuracy. |
