| 摘要 |
A wire bonder useful for assembling electronic components with fine metallic wire. The wire bonder in accordance with this invention forms a ball at a free end of a bonding wire by utilizing discharge arc and thereafter bonds the ball to a component. The wire bonder of the invention has a construction in which the atmosphere between the tip of the bonding wire and a discharge electrode disposed adjacent the tip of the bonding wire can be maintained as a reducing gas atmosphere. Especially when an aluminum wire, which is an easily oxidizable thin metallic wire, is used as the bonding wire, the wire bonder of the present invention improves the sphericity of the ball formed by discharge arc as well as the bondability. |
