| 摘要 |
PURPOSE:To simultaneously attain high heat conductivity with low stress by sealing a semiconductor chip with thermosetting resin which is the mixture of alumina and fused silica. CONSTITUTION:A silicon chip 2 on which a power transistor is formed and a silicon chip 3 on which a control circuit is formed are arranged on a frame 1. The elements of the silicon chips 2 and 3 are electrically connected by a wire 4, and the elements of the silicon chips 2 and 3 are electrically connected with the frame 1 by s wire 5. The silicon chips 2 and 3 are integrally formed by sealing resin 6. The sealing resin 6 is the mixture of alumina and fused silica, while the base material is constituted of epoxy resin, phenol resin and modified silicone epoxy resin. Thus, stress applied on the semiconductor chip is reduced, and the heat conductivity of the semiconductor chip to the external part is improved. |
