SYSTEM FOR INTERCONNECTING A SEMICONDUCTOR DIE TO OTHER DEVICES

摘要

Wafer fabrication techniques are used to form an interconnect structure made of alternating insulating and conductive layers where the conductive layers are selectively connected by means of vias through the insulating layers. The interconnect structure is formed on top of a surface of a semiconductor die with circuits thereon. Electrical connections can be made to any part of the die surface, not just at the edges of the die surface.