摘要 |
1,067,470. Semi-conductor devices. NIPPON GAISHI KABUSHIKI KAISHA. Aug. 10, 1964 [Aug. 8, 1963; July 17, 1964 (2)], No. 32533/64. Heading H1K. A heat-generating semi-conductor device 5, 6 is screwed into an inner heat-conducting sleeve 2 which is surrounded by an electricallyinsulating and heat-conducting sleeve or coating 1 (e.g. of a beryllia ceramic) and an outer heatradiating sleeve 3 provided with fins 4. The inner and outer sleeves 2, 3 may be cast in position, or shrink-fitted, or held by a heatconducting adhesive. |