| 摘要 |
<p>In a system for positioning a semiconductor chip package (10) with respect to a testing surface (22) the distance between the package (10) or the leads (12) thereof and the testing surface (22) is monitored while the package (10) is pushed towards the testing surface (22). When the distance monitored falls below a certain value, the package (10) is pushed further by a set distance. In this manner, good contact between the leads (12) of the package (10) and the contacts (20) of the testing surface (22) is achieved without destroying the coplanarity of the leads (12).</p> |
