Cold finger for semiconductor circuit and cryogenic device having such finger.

摘要

The finger (1) intended to cool a semiconductor circuit in thermal contact with its free end is hollowed out in order to receive a cryogenic fluid and the thickness of its wall (3), at least within a portion (11) of the finger which is adjacent to its base (6), gradually increases with decreasing distance from this base (6). The invention applies in particular to the cooling of infrared detectors.