| 摘要 |
A package for electronic components, especially MMIC components, is constructed from layers (12,14,16,18,20)) of ceramic cofired to form an annular piece. Metal pieces (10,22,24) are brazed onto the top and bottom of the annular piece to hermetically seal the package. Certain of the ceramic pieces (12,14,16,18,20) are coated with patterns of conductive material before cofiring. The conductive material forms DC power distribution lines (32A, 32B) to electronic components (28A, 28B) within the package and low loss RF feedthroughs (50A, 50B) into the package. <IMAGE> |
