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发明名称
METHOD OF THERMALLY TREATING COMPOUND SEMICONDUCTOR WAFER
摘要
申请公布号
JPH04188626(A)
申请公布日期
1992.07.07
申请号
JP19900315713
申请日期
1990.11.22
申请人
SAMSUNG ELECTRON CO LTD
发明人
PARUKU JIYOO SUN
分类号
H01L21/324;H01L21/208
主分类号
H01L21/324
代理机构
代理人
主权项
地址
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