COUPLING AGENT BETWEEN INORGANIC INSULATING FILM WITH SILICON AND POLYIMIDE RESIN FILM

摘要

PURPOSE:To prevent the corrosion of a wiring layer with a coupling agent for enhancing the adherence between a semiconductor substrate and a polyimide resin film by forming the agent of silico-aluminate ester compound and organic solvent and retaining the mixture amount constantly. CONSTITUTION:A silico-aluminate ester compound is formed by the formula represented by (R1O)2Al-O-Si(OR2)2, where the R1, R2 may be the same or different, and signify 1-4C alkyl group. The mixture ratio of the silico-aluminate ester compound should be in the range of 0.01-50wt%. The coupling agent 4 is interposed between a silicon dioxide film 2 on the substrate 1 and aluminum wiring layer 3, polyimide resin film 5. Thus, the bonding strength of the respective materials become uniform, and it can prevent the entrance of water content for corroding the aluminum wiring layer.