| 摘要 |
<p>PURPOSE:To enhance an inner conductor pattern in connectivity to components by a method wherein a round hole or a square hole is previously provided to a base material, and a round or square hole is bored also in a prepreg. CONSTITUTION:Square or round holes 5 and 6 are punched into ouer materials Y and a prepreg 4 composed of a base material 1a provided with an inner conductor pattern 2 and a base material 1, and the processed outer materials Y and the processed prepreg 4 are laminated and molded into a molded laminate. A through-hole is provided to the molded laminate through boring and plating, an etching resist is provided thereon, an outer conductor pattern is formed through etching, and a component 7 is inserted into the square or round holes 5 and 6 and directly soldered 8 to the inner conductor pattern 2. By this setup, adhesive is prevented from spreading over the inner conductor pattern 2, so that connection between the component 7 and the inner conductor pattern 2 is enhanced in reliability.</p> |
