发明名称 ELECTRONIC COMPONENT MOUNTING EQUIPMENT
摘要 PURPOSE:To enable a nozzle head to be lessened in size so as to operate at a high speed by a method wherein a first reflective plate whose surface confronting an electronic component is made to serve as a reflective surface is provided to the end of the nozzle head, and a second reflective plate is provided to the component suction surface of a nozzle. CONSTITUTION:An electronic component 5 sucked by a nozzle 4 is transferred to a recognition section through the rotation of a disc type rotary head provided with nozzle heads 3, it is recognized if an electronic component 5 deviates or not at this section, then the component 5 is transferred to a correction section. That is, the nozzle 3 is illuminated from below by a lighting equipment 10, and the image of the nozzle 3 is inputted into a component recognition device through a photodetective device 11. A first reflective plate 8 is provided to one end of the nozzle head 3, and a second reflective plate 9 is provided to the suction face of the nozzle 4, whereby a non-defective component is prevented from being mistaken for a defective component and data required for image processing can be obtained enough. By this process, the nozzle head 3 can be miniaturized and made to operate at a high speed.
申请公布号 JPH04188700(A) 申请公布日期 1992.07.07
申请号 JP19900311453 申请日期 1990.11.19
申请人 TOSHIBA CORP 发明人 FUKATSU KENTA
分类号 B23P21/00;H05K13/04 主分类号 B23P21/00
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