| 摘要 |
PURPOSE:To increase the intensity for reducing the deformation of island and metallic fine wire during resin sealing step by a method wherein a semiconductor element is mounted and bonded onto an island and after the wiring step using metallic fine wires, a resin film is formed of powder resin on the island metallic fine wire. CONSTITUTION:In order to inject a sealing resin in a cavity, powder resin 17 is sticked on the surfaces of an inner lead 11, an island 12 and metallic fine wires 15 to form a resin film 18 and then resin-sealed to form a resin-made outer shell 19. Accordingly, the mechanical strength against the deformation due to external force can be increased. Through these procedures, when the outer shell resin is injected in the cavity formed in a metallic mold to form the resin sealed outer shell, the occurrence of the deformation of especially the island support and the metallic fine wires 15 by the resin flow can be avoided and thereby the reliabilty and the yield can be enhanced. |
