| 摘要 |
PURPOSE:To prevent brazing material from flowing out to the back of an island and to enable a bonding wire to be prevented from coming into contact with the end of a semiconductor chip by a method wherein the island is provided with a side wall at its peripheral part and an insulator formed at the upper end of the side wall concerned. CONSTITUTION:An island 3 is supported by suspension pins 4 connected to the upper end of a side wall 6 at the outer frame of a lead frame, and inner leads 7 are arranged around the island 3 to constitute the lead frame. At this point, the front side of an insulator 1 is formed higher than that of a semiconductor chip 2 mounted on the island 3. By this setup, the semiconductor chip 2 is mounted on the inner base of the island 3 with a brazing material 5, and when the semiconductor chip 2 is electrically connected to the inner leads 7 with bonding wires 8 to assemble a semiconductor device, brazing material can be prevented from flowing to the back of the island 3 and the bonding wires 8 can be prevented from coming into contact with the end of a semiconductor chip or each other even if the bonding wires 8 sag.
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