发明名称 COOLING STRUCTURE
摘要 A cooling structure includes a substrate with at least one heat generating member fixed on the substrate. A heat radiating member is provided above the heat generating member and is formed with grooves at least on the part opposite the heat generating member. An elastic heat transfer sheet is provided between the heat generating member and the heat radiating member for conducting heat generated in the heat generating member to the heat radiating member.
申请公布号 CA1304830(C) 申请公布日期 1992.07.07
申请号 CA19890612004 申请日期 1989.09.19
申请人 SANO, TOSHIFUMI 发明人 SANO, TOSHIFUMI
分类号 H01L23/34;H01L23/367;H01L23/40;H01L23/433 主分类号 H01L23/34
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