| 摘要 |
<p>PURPOSE:To reduce the cutting margin at the time of cutting working by mounting a sheet-shaped guide plate having height higher than the height of laminating of a laminate and cutting the laminate together with the sheet-shaped guide plate. CONSTITUTION:When cutting working is started, the cutting bodies 2a of a cutting means 2 are brought into contact with the narrow upper end sections 4a of sheet-shaped guide plates 4 installed onto the side faces of a tabular base 3 through abrasives, and the cutting of the sheet-shaped guide plates 4 is started by the abrasives energized by the reciprocation of the cutting means 2. The contacting bodies 2a continue the cutting of the sheet-shaped guide plates 4 before the cutting bodies 2a are brought into contact with the upper end face of a semiconductor wafer laminate 1, the pectinate states of narrow groove width by the cutting clearance of the cutting bodies 2a are formed to the sheet-shaped guide plates 4, and the cutting bodies 2a are brought into contact with the upper end section of the semiconductor wafer laminate 1 under the states. Since the cutting bodies 2a are guide by pectinate grooves at that time, the vibrations of the cutting bodies are inhibited even when the cutting bodies receive exciting force in the direction rectangular to the reciprocation of the cutting bodies 2a. Accordingly, cutting clearance at the time of cutting working can be narrowed.</p> |
