| 摘要 |
<p>PURPOSE:To obtain stable junction by depressing a semiconductor device against an ambient cover by means of a linear motor vertically, supplying ambient gas to a lead joint section and melting partially the bonding agent provided to the lead joint section through the penetration and heating of the ambient cover. CONSTITUTION:A semiconductor device 5 mounted on a substrate 7 is positioned on a junction pattern on the substrate 7. A linear motor 3 forces weight 2 to depresses the semiconductor device 5 where the application of pressure is controlled. At that time, an ambient gas 4 introduced from a gas intake pipe 1a passes through a gas flow passage 1b in an ambient cover 1 and flows into a junction between a lead 6 and the substrate 7, thereby generating a favorable ambient condition. Under this condition, a bonding agent 8 is heated by laser light 9 emitted from a laser head, thereby completing the junction between the lead 6 and the substrate 7.</p> |
