| 摘要 |
PURPOSE:To obtain a sufficient adhesion strength with a bonding wire while keeping a gap between inner leads to be small by allowing tip parts of the inner lead to be in zigzag manner alternately and an area of the tip part only of the inner lead to be large. CONSTITUTION:Although an outer lead 3 of s lead frame 1 stays the same, an area of a tip part of an inner lead 2 is increased and then a bonding pad 6 and the tip part are connected by a wire 5 by placing the tip part in zigzag manner alternately. Even if a lead pitch becomes small and the inner lead 3 becomes thin, wire bonding is performed positively and an are of a tip part of the inner lead 2 can be increased without allowing a gap of the tip part to be narrow and short-circuited. Also, a gap between the lead frame 1 and a semiconductor chip 4 does not become wide, and therefore the wire is prevented from becoming long. Hence miniaturization and multiple pins can be realized. |
