| 摘要 |
<p>PURPOSE:To obtain a device, which has a high reliability and in which the thermal strain of a substrate is never caused, by a method wherein the device has a plurality of systems of vacuum exhaust system, grooves of the amount of the number of the systems are formed in the chucking surface of a holding base in adjacent to each other and vacuum exhaust tubes constituting each vacuum exhaust system are branched in each groove and are opened. CONSTITUTION:A substrate holding device has a plurality of systems of vacuum exhaust systems, which respectively consist of a holding base 2 which sucks in a vacuum the rear of a substrate 1 and holds the substrate 1, vacuum pumps (first and second vacuum pumps 41 and 42) 4 for sucking in a vacuum the substrate 1, vacuum exhaust tubes (first and second vacuum exhaust tubes 31 and 32) 3 for connecting the pumps 4 to a chucking surface 22 or the holding base 2 and pressure adjusting means (first and second conductance variable valves 61 and 62 and first and second valves 71 and 72) 6 and 7 which are respectively provided in the middles of the tubes 3 and adjust a vacuum suction pressure, grooves (first and second grooves 211 and 212) 21 of the amount of the number of the systems of the vacuum exhaust systems are formed in the surface 22 of the base 2 in such a way that at least one group of the grooves are in adjacent to each other and the tubes 3 constituting the above respective vacuum exhaust system are branched in each groove 21 and are opened. In addition, for example, flow paths 10 are piped in the vicinity of a chucking surface 22 of a wafer chuck 2 and temperature adjusting wafer for preventing the temperature rise of a wafer 1 in course of exposure is circulated from a constant temperature bath.</p> |
