| 摘要 |
PURPOSE:To prevent oxidation of a copper film due to heat treatment in air by providing a 1st conductive film made of copper on the entire surface of a board and providing a 2nd conductor film made of at least either of solder or tin onto the 1st conductor film so as to be overlapped thereon. CONSTITUTION:A kneaded material comprising dielectric ceramic materials for high frequency such as BaTiO3 and MgTiO3 groups is formed cylindrical and baked to be a base 1. In this case, the roughness of the base 1 is adjusted in the range 0.1mum-15.0mum. Next, the 1st conductive film 2 made of copper is formed to an inner circumferential face, an outer circumferential face and both end faces of the base 1, that is, the entire surface of the base 1 by the plating method. Then a 2nd conductive film 3 made of at least either of solder and tin is formed on the 1st conductive film 2 by the plating method. Thus, the copper film is not oxided with heat treatment not in an inactive gas but in air. |
