Depositing protective layers on mounted chips - sets chip eccentrically on turntable and partly centrifuges protective layer for uniform distribution

摘要

Protective layers are deposited onto mounted chips by droplet application of the protective material onto the surface to be coated. The mounted chip (10) is secured eccentrically on a turntable whose rotation partly centrifuges the protective material and simultaneously distributes it uniformly over the surface to be protected. The thickness of the protective layer (30) is determined by certain characteristics, such as the consistency, hardening and drying of the protective material, the speed of centrifuging, the eccentric radius of the turntable, and times for individual process steps, such as droplet running and centrifuging times. ADVANTAGE - Facility for forming very thin, uniform protective films.