VERFAHREN UND STRUKTUR UM EINE GEZIELTE AENDERUNG IN EINEM PAKET VON MEHREREN MODULAREN BAUELEMENTEN ZU ERMOEGLICHEN.

摘要

In a semiconductor module with a substrate having a plurality of semiconductor devices mounted on the top surface, an internal metallurgy system interconnecting the devices, an auxiliary set of conductive lines with periodically occurring surface connecting terminals, engineering change terminals with electrical connections to the device terminals and to the internal metallurgy system, the improvement being engineering change devices, terminals on the engineering change devices to establish electrical contact with the engineering change terminals and the surface connecting terminals, a tailorable metallurgy system which permits establishing selective electrical connections between individual terminals of the engineering change devices, and deletable surface lines on the substrate to selectively electrically isolate selected engineering change terminals from the internal metallurgy.