发明名称 SPUTTERING TARGET AND PROTECTIVE FILM USING THE SPUTTERING TARGET
摘要 PURPOSE:To obtain same film characteristics under constant film forming conditions by a method wherein an Al-Si target is manufactured by a cast alloy method. CONSTITUTION:In order to manufacture an Al-Si alloy target, a cast alloy method is employed. First, 70 at.% of Si is put into a crucible and heated to 1500 deg.C in a vacuum melting furnace and then 30 at.% of Al is put into the crucible and Al and Si are naturally mixed under a constant temperature of 1500 deg.C and cast into a mold. At that time, crystal grains are distributed uniformly over the whole surface and, moreover, as the target is made of cast alloy, the density is 100%, which is very convenient for sputtering. With this constitution, the same film characteristics can be obtained under constant film forming conditions and density unevenness and variation can be avoided.
申请公布号 JPH04184732(A) 申请公布日期 1992.07.01
申请号 JP19900315395 申请日期 1990.11.20
申请人 SEIKO EPSON CORP 发明人 AOYAMA AKIRA
分类号 B22D21/04;C23C14/06;C23C14/34;G11B7/24;G11B7/254;G11B7/257;G11B7/26 主分类号 B22D21/04
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