A method and apparatus for bonding a non-conductive member to a conductive member.

摘要

A method and apparatus for bonding a non-conductive member (26) to a conductive member (24) by applying adhesive (27) between mating surfaces of the non-conducting member (26) and the conducting member (24) and placing an electrode (20) adjacent the non-conductive member (26) overlying the mating surfaces. An RF generator (22) applies an electric field between the non-conducting and conducting members (24,26) to cure the adhesive (22) by dielectric heating.