UNSEALING METHOD OF IC PACKAGE,申请号JP19900315315-传众专利搜索

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发明名称	UNSEALING METHOD OF IC PACKAGE
摘要
申请公布号	JPH04184957(A)	申请公布日期	1992.07.01
申请号	JP19900315315	申请日期	1990.11.20
申请人	NEC CORP	发明人	INAGAKI MASAFUMI
分类号	G01R31/26;H01L21/66	主分类号	G01R31/26
代理机构		代理人
主权项
地址

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