| 摘要 |
PURPOSE:To obtain a photosensitive resin compsn. not causing cracking at the time of heat treatment by using a resin represented by a specified formula and enabling the formation of a negative pattern by irradiation with UV rays. CONSTITUTION:A resin represented by formula I is used and the formation of a negative type pattern by irradiation with UV rays is enabled. In the formula I, each R<1> is 1-3C lower alkyl or aryl, plural R<1>'s may be different from each other, >=20% of plural R<2>'s are ethylene oxide, the remainder is vinyl, lower alkyl or aryl and each of n, m and l is a positive integer. The resin can satisfy both photosensitivity and heat resistance because it contains ethylene oxide as mentioned above and a photosensitive heat resistant resin compsn. not causing cracking at the time of heat treatment is obtd. |
