SOLDER NOZZLE ASSEMBLY

摘要

A nozzle assembly for depositing solder onto a series of conductive surfaces such as the mounting pads of a surface mount integrated circuit board includes an upper nozzle mount 15 and a removeable nozzle head 27 which has an interior bore for receiving a portion of the nozzle mount and an elongate heat source 25. The nozzle head also includes an orifice for receiving solid solder 47 fed within the interior bore to contact the elongate heat source. The interior bore terminates in a solder reservoir for molten solder which is fed within the interior bore to contact the elongate heat source. The molten solder is dispensed through a tip opening to deposit uniform amounts of solder on each pad.