| 摘要 |
<p>PURPOSE:To facilitate the increase in a device capacity by a method wherein the surfaces of two chips whereon elements are formed are bonded onto both surfaces of one TAB tape. CONSTITUTION:An Au wire is fed from a capillary onto Al electrode pads formed on the surface of a chip 1 so as to form the Al ball bumps as outer connecting electrodes 2 by ultrasonic thermal pressure fixing step. Next, thic chip 1 and the Au bumps of a pattern chip 1 having mirror-inverted surface are aligned with the wirings printed on both surfaces of a TAB tape 3 by the alignment step using X-rays and then the TAB tape 3 comprising PI tape with a Cu foil stuck thereon is inner-lead bonded by the thermal pressure fixing step. Furthermore, the TAB tape 3 is outer-lead bonded onto the lead frames 4 comprising Cu-plated 42 alloy also by the thermal pressure fixing step. Finally, the whole body from the chips 1 to the lead frames 4 is seal-molded in epoxy base molding resin 5 using a molding machine to complete a memory IC.</p> |
