| 摘要 |
PURPOSE:To make possible a high-accuracy surface mounting by a method wherein the widths of the fixing parts of self-alignment leads are made wider than those of the fixing parts of other leads. CONSTITUTION:Self-alignment leads 5, each having a fixing part 7 made several times wider than the width of a fixing part 4 of each lead 3, are respectively provided at the four corners of a package 2. Moreover, some of the leads 5 are provided in such a way that they are further made wider to form into self-alignment leads 6 for direction identification use and the directivity of a semiconductor device 1 can be identified by the arrangement state of the leads 6. Thereby, a sufficient self-alignment force is obtained at the time of a packaging and even if the positional deviation at the time of mounting of the device 1 is generated, the deviation is properly corrected and the high- accuracy surface mounting can be conducted. |
