发明名称 |
Semiconductor device having inner leads extending over a surface of a semiconductor pellet |
摘要 |
According to the present invention, as improvement in the adhesion of inner leads with a packaging resin in a resin-sealed semiconductor device is attained by spreading leads on or near the circuit-forming face of a pellet, or on or near the main non-circuit-forming face of the pellet to extend the lengths of the inner leads on or under the pellet.
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申请公布号 |
US5126821(A) |
申请公布日期 |
1992.06.30 |
申请号 |
US19900529448 |
申请日期 |
1990.05.29 |
申请人 |
HITACHI, LTD.;HITACHI VLSI ENGINEERING CORP. |
发明人 |
OKINAGA, TAKAYUKI;TACHI, HIROSHI;OZAKI, HIROSHI;OTSUKA, KANJI;FURUKAWA, MICHIAKI;YAMASAKI, YASUYUKI |
分类号 |
H01L21/52;H01L21/58;H01L23/28;H01L23/495;H01L23/498;H01L23/50 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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