发明名称 |
METHOD OF MAKING A HYBRID ELECTRONIC ARRAY |
摘要 |
A method and apparatus for producing a highly packed hybrid array. The packing density of the hybrid array is increased by providing a barrier between closely adjoining strip conductors on a substrate. The barrier reduces the occurrence of short circuits between adjacent strip conductors when an adhesive that is used to glue a chip to the substrate is pushed out from under the chip.
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申请公布号 |
US5125153(A) |
申请公布日期 |
1992.06.30 |
申请号 |
US19900611017 |
申请日期 |
1990.11.09 |
申请人 |
OERLIKON-CONTRAVES AG |
发明人 |
FREY, RAYMOND;GLAUS, FREDY;HEUSLER, FREDY;STEINMANN, JURG |
分类号 |
H05K1/18;H01L25/04;H01L25/07;H01L25/075;H01L25/13;H01L25/18;H01L33/00 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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