发明名称 METHOD OF MAKING A HYBRID ELECTRONIC ARRAY
摘要 A method and apparatus for producing a highly packed hybrid array. The packing density of the hybrid array is increased by providing a barrier between closely adjoining strip conductors on a substrate. The barrier reduces the occurrence of short circuits between adjacent strip conductors when an adhesive that is used to glue a chip to the substrate is pushed out from under the chip.
申请公布号 US5125153(A) 申请公布日期 1992.06.30
申请号 US19900611017 申请日期 1990.11.09
申请人 OERLIKON-CONTRAVES AG 发明人 FREY, RAYMOND;GLAUS, FREDY;HEUSLER, FREDY;STEINMANN, JURG
分类号 H05K1/18;H01L25/04;H01L25/07;H01L25/075;H01L25/13;H01L25/18;H01L33/00 主分类号 H05K1/18
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