| 摘要 |
A wafer transfer device which includes a lifter system for lifting wafers seated in a cassette, a chuck system having at least two pairs of chuck members on each of which a plurality of grooves for holding the wafers therein are formed and serving to hold the wafers, which are lifted by the lifter system, between these chuck members, and a carrier system for carrying the wafers together with the chuck system. The wafer holding grooves on one of the paired chuck members are in series with those on one of the other paired chuck members, and the wafer holding grooves on one of the paired chuck members are parallel to those on one of the other paired chuck members.
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