发明名称 Tape-form electronic component package
摘要 A tape-form electronic component package accommodates a plurality of electronic components in a carrier tape. A tape main body has a plurality of cavities, each having a shape indicating a direction, for accommodating electronic components respectively. The cavities are arranged obliquely against a longer side of the tape main body.
申请公布号 US5125508(A) 申请公布日期 1992.06.30
申请号 US19910794366 申请日期 1991.11.13
申请人 MURATA MANUFACTURING CO., LTD. 发明人 YAMAMOTO, TAKASHI
分类号 B65D73/02;H05K13/00 主分类号 B65D73/02
代理机构 代理人
主权项
地址