发明名称 RESIN-SEALED SEMICONDUCTOR DEVICE
摘要 PURPOSE:To realize a multiterminal system, to reduce a defective product and to shorten a development period by a method wherein an insulating substrate is installed between both positions corresponding respectively to an inner lead for a first lead and an inner lead for a second lead. CONSTITUTION:A first lead 7 and a second lead 8 which is faced with an inner lead 7b and an outer lead 7c for the first lead 7 are formed. An insulating substrate is installed between both positions corresponding respectively to the inner lead 7B for the first lead 7 and an inner lead 8B for the second lead 8. Consequently, two rows of leads, i.e., the first lead 7 and the second lead 8, can be arranged inside a mounting area, and the number of leads can be increased. The gap between the inner leads 7b, 8b for the first lead 7 and the second lead 8 is filled with the insulating substrate, and it is possible to prevent a resin from dropping and flowing out at a resin sealing operation. As a result, a resin-sealing defect can be reduced, a metal mold for resin-sealing use can be abolished, and a process becomes simple. Thereby, a multiterminal system is realized, a defective product is reduced and a development period can be shortened.
申请公布号 JPH04181763(A) 申请公布日期 1992.06.29
申请号 JP19900310254 申请日期 1990.11.16
申请人 HITACHI LTD 发明人 JIN HIROSHIGE;SUZUKI HIROMICHI;NAITO TAKAHIRO
分类号 H01L23/28;H01L23/50 主分类号 H01L23/28
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