| 摘要 |
PURPOSE:To restrain the size of a semiconductor chip from being made large and to make the electric resistance of a power-supply interconnection inside the chip proper by a method wherein a power-supply pad is formed in the active region of the semiconductor chip. CONSTITUTION:A semiconductor chip 1 is provided with the following: an analog module 9 formed of an analog circuit; and a digital module 10 formed of a digital circuit. Regions in which the modules 9, 10 have been formed are set as active regions; regions other than them are set as inactive regions. The chip is provided with leads 11 to 28 supported by a package or the like and with bonding pads 31 to 48. The bonding pads 31, 32 are formed in the active regions formed in the analog module 9 and the digital module 10, and are used as power-supply pads. Consequently, the length of power-supply interconnections reaching individual functional block cells inside the chip 1 from the power-supply pads is made proper. Thereby, it is possible to restrain the size of the chip from being made large and to make the electric resistance of the power-supply interconnections inside the chip proper. |
