| 摘要 |
<p>PURPOSE:To avoid the deterioration of moisture resistance of outer leads due to its intrusion in a semiconductor device of 2-layer filling structure of soft resin by disposing an L- or C-shaped forming part of an outer lead to be removed through resin of 2-layer in the upper layer of all resin and introducing the other part into the lower layer. CONSTITUTION:A ceramic substrate 12 which places a semiconductor element 13 is secured to the bottom of a case 11 which is opened on the surface, and outer lead 15 which are connected to the electrode of the element 13 are led from both ends of the substrate 12 to the open ends of the case 11. Though an L- or C-shaped part 20 is formed on the way at the leads 15 to provide a strength against tension in this structure, silicone rubber 17 for sealing the open end at this time is formed in a 2-layer filling structure, the L- or C-shaped bent part is buried in the upper layer of the rubber 17 so that the part does not exist in the space in the case 11. In this manner, external tensile strength is all absorbed in the rubber 17.</p> |
